Title:
PACKAGING STRUCTURE, ELECTRONIC EQUIPMENT, AND PREPARATION METHOD FOR PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/143721
Kind Code:
A1
Abstract:
Provided are a packaging structure, electronic equipment, and a preparation method for the packaging structure. This packaging structure comprises: a substrate (100); a sensing assembly (200), the sensing assembly (200) being arranged on an upper surface of the substrate (100) and being electrically connected to the substrate (100); and a package colloid (300), the package colloid (300) being arranged on the upper surface of the substrate (100) and covering at least part of the sensing assembly (200), wherein the sensing assembly (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least part of a light-transmitting area (310) arranged corresponding to the optical sensor (220). In this way, a capacitive sensor and an optical sensor are packaged in a packaging structure, so that the integrated degree of the packaging structure can be improved, and packaging space is saved.
Inventors:
DONG HAOXIANG (CN)
Application Number:
PCT/CN2016/089356
Publication Date:
August 31, 2017
Filing Date:
July 08, 2016
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
A61B5/024; A61B5/00; A61B5/1455; H01L21/56; H01L27/146
Foreign References:
| CN203858644U | 2014-10-01 | |||
| TW201607013A | 2016-02-16 | |||
| CN101587400A | 2009-11-25 | |||
| CN203982403U | 2014-12-03 |
Other References:
See also references of EP 3235425A4
None
None
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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