Title:
PACKAGING STRUCTURE, MANUFACTURING METHOD FOR PACKAGING STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/044846
Kind Code:
A1
Abstract:
Embodiments of the present application provide a packaging structure, a manufacturing method for the packaging structure, and an electronic apparatus. In the packaging structure, a pre-manufactured pin plastic packaging element is used, and the pin plastic packaging element and an electronic device are disposed on a main substrate, thereby solving the problem that there is a height difference between pins or between a pin and a pad of the electronic device, and achieving high coplanarity. In addition, the packaging structure of the embodiments of the present application, in addition to the main substrate, further comprises a pin substrate, and the pin substrate can assist the main substrate in wiring, thereby reducing the wiring pressure of the main substrate, and improving design flexibility of the packaging structure. Moreover, the manufacturing method for the packaging structure can further reduce the machining cost and improve production efficiency.
Inventors:
TONG LIANG (CN)
LIU LIJUN (CN)
ZHANG SHAN (CN)
LIU GUOWEN (CN)
XU BIN (CN)
LIU LIJUN (CN)
ZHANG SHAN (CN)
LIU GUOWEN (CN)
XU BIN (CN)
Application Number:
PCT/CN2021/120614
Publication Date:
March 30, 2023
Filing Date:
September 26, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/538
Foreign References:
| CN105118823A | 2015-12-02 | |||
| KR20140020506A | 2014-02-19 | |||
| US20180308787A1 | 2018-10-25 | |||
| US20140110856A1 | 2014-04-24 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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