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Title:
PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/054315
Kind Code:
A1
Abstract:
A packaging structure and a packaging method. The packaging structure comprises: a substrate (101) having opposite first surface and second surface, a circuit layer (102) being provided within the substrate (101); a first functional chip (201) on a first surface of the substrate (101), the first functional chip (201) having opposite first functional surface and first back surface, a bonding pad (202) being provided on the first functional surface, the first back surface being fixedly engaged with the first surface, and the bonding pad (202) being electrically connected with the circuit layer (102) by means of a wire (203); a second functional chip (301) flip-mounted on a second surface of the substrate (101), the second functional chip (301) having opposite second functional surface and second back surface, the second functional surface being opposite to the second surface, and the second functional surface being electrically connected with the circuit layer (102) by means of a part of the circuit layer (102) exposed out of the second surface of the substrate (101); a solder bump (401) on the second surface of the substrate (101), the solder bump (401) being electrically connected with the circuit layer (102) by means of a part of the circuit layer (102) exposed out of the second surface of the substrate (101). The present application reduces the size of the packaging structure and improves the integration level of the packaging structure.

Inventors:
WANG ZHIQI (CN)
SHEN ZHIJIE (CN)
GENG ZHIMING (CN)
LUO XIAOFENG (CN)
Application Number:
PCT/CN2017/102607
Publication Date:
March 29, 2018
Filing Date:
September 21, 2017
Export Citation:
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Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L23/31; H01L21/56; H01L23/48; H01L23/488
Foreign References:
CN106298699A2017-01-04
CN206259337U2017-06-16
CN105448944A2016-03-30
CN103681702A2014-03-26
CN1514493A2004-07-21
CN101165894A2008-04-23
CN1463141A2003-12-24
CN105047621A2015-11-11
CN103325799A2013-09-25
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
Download PDF:
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