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Patent Searching and Data


Title:
PACKAGING STRUCTURE AND PACKAGING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/221512
Kind Code:
A1
Abstract:
A packaging structure (10) and a packaging module (2). The packaging structure comprises a heat sink body (100) and an accommodating channel (300). The accommodating channel (300) comprises a first channel (320), an accommodating space (340) and a second channel (360), which communicate with one another in sequence, the accommodation space (340) being used for accommodating a gate region (240), the first channel (320) being used for accommodating an optical fiber incident end (220), and the second channel (360) being used for accommodating an optical fiber emergent end (260); and when the gate region (240) is arranged in the accommodating space (340), the gate region (240) is arranged spaced apart from a wall surface of the accommodating space (340).

Inventors:
ZHANG HUI (CN)
SHAO XIAN (CN)
GU YANG (CN)
LENG ZHUOYAN (CN)
HU GUOYONG (CN)
LIU XUEYA (CN)
HUANG ZHONGYA (CN)
YAN DAPENG (CN)
Application Number:
PCT/CN2022/142123
Publication Date:
November 23, 2023
Filing Date:
December 26, 2022
Export Citation:
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Assignee:
WUHAN RAYCUS FIBER LASER TECHNOLOGIES CO LTD (CN)
International Classes:
H01S3/042
Foreign References:
CN114640010A2022-06-17
CN109612602A2019-04-12
CN102124383A2011-07-13
CN213212647U2021-05-14
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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