PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

Title:

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2021/040178

Kind Code:

A1

Abstract:

An embodiment relates to a packaging substrate and a semiconductor device, and comprises: an element unit including semiconductor elements; and a packaging substrate electrically connected to the element unit, wherein a glass substrate is applied to the packaging substrate as a core so as to more closely connect the semiconductor elements and a motherboard, such that an electrical signal is transmitted at as short a distance as possible. Accordingly, provided is a packaging substrate which can greatly improve electrical properties, such as signal transmission speed, etc., can further simplify an insulation film treatment process by substantially preventing the occurrence of parasitic elements, and is applicable to a high-speed circuit.

Inventors:

RHO YOUNGHO (KR)
KIM SUNGJIN (US)
KIM JINCHEOL (KR)

Application Number:

PCT/KR2020/004898

Publication Date:

March 04, 2021

Filing Date:

April 10, 2020

Export Citation:

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Assignee:

SKC CO LTD (KR)

International Classes:

H01L23/48; H01L23/498; H01L23/522

Foreign References:

US20130293482A1	2013-11-07
KR20180116733A	2018-10-25
KR20150014167A	2015-02-06
KR20100097383A	2010-09-03
JP2005235497A	2005-09-02
US201962890689P	2019-08-23
KR20190008103A	2019-01-23
KR20160114710A	2016-10-05
KR101468680B1	2014-12-04

Other References: