Title:
PAD CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO2008002811
Kind Code:
B1
Abstract:
A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.
Inventors:
MAVLIEV RASHID A (US)
CHEN HUNG CHIH (US)
CHEN HUNG CHIH (US)
Application Number:
PCT/US2007/071701
Publication Date:
December 24, 2008
Filing Date:
June 20, 2007
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
MAVLIEV RASHID A (US)
CHEN HUNG CHIH (US)
MAVLIEV RASHID A (US)
CHEN HUNG CHIH (US)
International Classes:
B24B53/00
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