Title:
PALLADIUM PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2002/103084
Kind Code:
A1
Abstract:
A palladium plating solution, characterized in that it comprises a soluble palladium salt in an amount of 0.1 to 40.0 g&sol liter in terms of palladium, 0.01 to 10 g&sol liter of a pyridine−carboxylic acid and&sol or at least one selected from among a soluble iron salt, zinc salt, thallium salt and tellurium salt and the like in an amount of 0.002 to 1.0 g&sol liter in terms of metal, 0.005 to 10 g&sol liter of amine derivative of pyridine−carboxylic acid, an aldehydobenzoic acid derivative, and 0.001 to 1.2 g&sol liter of an anionic surfactant or an amphoteric surfactant. The palladium plating solution allows the preparation of a highly pure and stable palladium precipitate which is excellent in specular gloss, forms a plating film having a thickness of 5 μm or more and is free from the occurrence of a crack.
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Inventors:
AKIMOTO TAKEUMI
ARAI YOTARO
ARAI YOTARO
Application Number:
PCT/JP2001/005107
Publication Date:
December 27, 2002
Filing Date:
June 15, 2001
Export Citation:
Assignee:
KOJIMA CHEMICALS CO LTD (JP)
International Classes:
C25D3/52; C25D3/50; C25D3/56; (IPC1-7): C25D3/50
Foreign References:
| JP2001192885A | 2001-07-17 | |||
| JPH0711476A | 1995-01-13 | |||
| JPH07278870A | 1995-10-24 | |||
| JP2000303199A | 2000-10-31 | |||
| US4911799A | 1990-03-27 | |||
| US6159623A | 2000-12-12 | |||
| US4491507A | 1985-01-01 | |||
| JP2000026991A | 2000-01-25 |
Other References:
See also references of EP 1396559A4
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