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Patent Searching and Data


Title:
PARISON AND CONTAINER BLOW-MOLDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/089054
Kind Code:
A1
Abstract:
[Problem] To provide a parison with which a container having a bottom that is thicker than the areas forming the container section even though the container section is squeezable, can be manufactured, and a blow-molding method using the parison. [Solution] A parison (50), wherein the external shapes of the neck-forming section (51) and the bottom-forming section (52) are formed in the same respective shapes as the external shapes of the neck (20) and the bottom (15) of the container (1) to be blow-molded, and the body-forming section between the two formed sections is injection-molded to be thinner than the bottom-forming section. A blow-molding method obtained by pumping pressurized air into the parison to extend the body-forming section of the parison in the axial direction and move the parison bottom-forming section toward the inner bottom surface of the die (40), bringing the outer bottom surface of the bottom-forming section into contact with the inner bottom surface of the die and controlling the movement of the bottom by abutting the outer circumferential surface of the bottom-forming section against the bottom inner circumferential surface of the die, and then extending the body-forming section in the transverse direction to bring the shoulder-forming section and the body-forming section into contact with the inner surface of the die.

Inventors:
OGATA SATOSHI (JP)
TESHIMA KENZO (JP)
Application Number:
PCT/JP2012/081912
Publication Date:
June 20, 2013
Filing Date:
December 10, 2012
Export Citation:
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Assignee:
YOSHIDA INDUSTRY CO (JP)
International Classes:
B29C49/06; B29B11/14; B65D1/00
Foreign References:
JP2010274950A2010-12-09
JPH07156933A1995-06-20
JPH05330535A1993-12-14
JP3924082B22007-06-06
JPH02248232A1990-10-04
JPH05301274A1993-11-16
JP3924082B22007-06-06
Other References:
See also references of EP 2792466A4
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
All international patent business corporation (JP)
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Claims: