PARTICLE BEAM TREATMENT DEVICE AND OPERATION METHOD THEREFOR

Title:

PARTICLE BEAM TREATMENT DEVICE AND OPERATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2014/174592

Kind Code:

A1

Abstract:

In the present invention, the energy of a particle beam emitted from an accelerator (1) is set for each slice group (F) which includes at least two adjacent slices (S). When setting the attenuation for each slice (S) in the slice groups (F), for each slice group (F), with respect to the slice (S) at the deepest position in the slice group (F), the energy emitted from the accelerator (1) is set to a value that is higher than the energy corresponding to the slice (S) at the deepest position so that a transmissive plate has a prescribed thickness. The thickness of the transmissive plate set for each slice group (F) is configured so that the thickness set for a deep position slice group (F) is greater than the thickness set for a shallow position slice group (F), and the thickness set for the deepest position slice group (F) is thicker than the thickness set for the shallowest position slice group (F).

Inventors:

KATAYOSE TADASHI (JP)
SUGAHARA KENGO (JP)

Application Number:

PCT/JP2013/061920

Publication Date:

October 30, 2014

Filing Date:

April 23, 2013

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

A61N5/10

Foreign References:

JP2008161716A	2008-07-17
JP2007185423A	2007-07-26
JP2007185423A	2007-07-26
JPH03236862A	1991-10-22
JPH08298200A	1996-11-12

Other References: