Title:
PASTE-LIKE RESIN COMPOSITION, HIGH–THERMAL CONDUCTIVITY MATERIAL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/132051
Kind Code:
A1
Abstract:
A paste-like resin composition according to the present invention includes silver-containing particles A, a solvent B, and a thermosetting resin C, and the difference between a Hansen solubility parameter a of the silver-containing particles A measured with the method described here and a Hansen solubility parameter b of the solvent B is 4.3 to 9.8. Method: In a 10 ml glass container, add 2 mL of any solvent selected from among the listed solvents for evaluation to 0.2 g of the silver-containing particles A, and after stirring for 5 seconds with a vortex mixer, visually evaluate dispersibility using the four levels listed here. Input the solvent for evaluation and the evaluation result for dispersibility in the solvent into the Sphere program of computer software HSPiP (version 5.2.02) and calculate the Hansen solubility parameter. Solvents for evaluation: water, methanol, toluene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, acetone, acetonitrile, ethyl acetate, methyl ethyl ketone, 1-butanol, cyclohexanol, isopropyl alcohol Evaluation: 0: Does not disperse. 1: Precipitation completes in less than 10 minutes. 2: Precipitation completes when 10 minutes or more, and less than 1 hour has passed. 3: Precipitation completes when 1 hour or more, and 12 hours or less have passed.
Inventors:
HAMASHIMA AZUMI (JP)
KASHINO TOMOMASA (JP)
YOSHIDA MASATO (JP)
ABE YUI (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
KASHINO TOMOMASA (JP)
YOSHIDA MASATO (JP)
ABE YUI (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2022/000342
Publication Date:
July 13, 2023
Filing Date:
January 07, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08K3/08; C09J11/04; C08K5/00; C08L101/12; H01B1/22; H01L21/52
Domestic Patent References:
| WO2021044915A1 | 2021-03-11 | |||
| WO2017170023A1 | 2017-10-05 |
Foreign References:
| JP2018174125A | 2018-11-08 | |||
| JP2010090211A | 2010-04-22 | |||
| JP2015206087A | 2015-11-19 | |||
| JP2011256382A | 2011-12-22 | |||
| JP2013143243A | 2013-07-22 | |||
| JP2022018051A | 2022-01-26 |
Other References:
KAZUYOSHI NATSUMI, KAZUYOSHI YAMADA, HIROHIKO FURUI, AKIRA FUJITA, HAJIME KISHI: "Low Viscosity Electrical Conductive Adhesives using Phase Structure of Epoxy/in-situ Polymerized Methacrylic Resin Blends", JOURNAL OF NETWORKPOLYMER, JP, vol. 41, no. 5, 10 September 2020 (2020-09-10), JP, pages 193 - 200, XP009547626, ISSN: 2433-3786, DOI: 10.11364/networkedpolymer.41.5_193
PETERSEN JACOB B., MERUGA JEEVAN, RANDLE JAMES S., CROSS WILLIAM M., KELLAR JON J.: "Hansen Solubility Parameters of Surfactant-Capped Silver Nanoparticles for Ink and Printing Technologies", LANGMUIR, AMERICAN CHEMICAL SOCIETY, US, vol. 30, no. 51, 30 December 2014 (2014-12-30), US , pages 15514 - 15519, XP093077542, ISSN: 0743-7463, DOI: 10.1021/la502948b
PETERSEN JACOB B., MERUGA JEEVAN, RANDLE JAMES S., CROSS WILLIAM M., KELLAR JON J.: "Hansen Solubility Parameters of Surfactant-Capped Silver Nanoparticles for Ink and Printing Technologies", LANGMUIR, AMERICAN CHEMICAL SOCIETY, US, vol. 30, no. 51, 30 December 2014 (2014-12-30), US , pages 15514 - 15519, XP093077542, ISSN: 0743-7463, DOI: 10.1021/la502948b
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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