Title:
PASTE FOR PHOTOELECTRIC CONVERSION LAYER AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/100614
Kind Code:
A1
Abstract:
In the present invention, as a paste for forming a photoelectric conversion layer, prepared is a paste containing a semiconductor, fibers, and a solvent. The content of the fibers is adjusted to 0.0001 to 1 part by mass relative to 100 parts by mass of the semiconductor. The semiconductor may include a metal oxide (in particular, titanium oxide particles). The fibers may include organic fibers (in particular, cellulose fibers). The solvent may include an acyclic compound. The acyclic compound may include at least one selected from the group consisting of an alcohol-based solvent, a glycol-based solvent, a glycol ether-based solvent, a glycol ether ester-based solvent, and a glycol ester-based solvent. The acyclic compound may include a compound having a hydroxyl group and/or an ether bond in a molecule. The paste may further include an ionic solvent. The paste has both screen printing properties and low temperature film forming properties.
More Like This:
Inventors:
SATO HIROKI (JP)
FUKUI KAZUHISA (JP)
ISHIZU YUSUKE (JP)
FUKUI KAZUHISA (JP)
ISHIZU YUSUKE (JP)
Application Number:
PCT/JP2022/041903
Publication Date:
June 08, 2023
Filing Date:
November 10, 2022
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
H01G9/20
Domestic Patent References:
| WO2018168225A1 | 2018-09-20 |
Foreign References:
| JP2017224815A | 2017-12-21 | |||
| JP2016039212A | 2016-03-22 | |||
| JP2014143118A | 2014-08-07 |
Attorney, Agent or Firm:
SAKANAKA Hiroshi et al. (JP)
Download PDF: