Title:
PASTE TRANSFER UNIT, ELECTRONIC COMPONENT MOUNTING DEVICE, AND TRANSFERRED FILM THICKNESS MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/103262
Kind Code:
A1
Abstract:
When measuring the film thickness of a coating film (25a) which is made of a flux (25) serving as a bonding paste and is formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured via a translucent member (51) by means of optical interferometry using an optical film thickness measurement sensor (53) which is provided below the transfer stage (24). Consequently, the film thickness of the flux (25) in the transfer area (26) can be automatically and accurately measured without requiring any cumbersome measuring operation.
Inventors:
IKEDA MASANORI
HASSAKU YOUSUKE
FURUICHI SATOSHI
TANIGUCHI MASAHIRO
TOMOMATSU MICHINORI
HASSAKU YOUSUKE
FURUICHI SATOSHI
TANIGUCHI MASAHIRO
TOMOMATSU MICHINORI
Application Number:
PCT/JP2013/007477
Publication Date:
July 03, 2014
Filing Date:
December 19, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05K13/04; B23K1/00; B23K3/00; H01L21/60; H05K3/34; B23K101/42
Foreign References:
| JP2012043904A | 2012-03-01 | |||
| JP4908955B2 | 2012-04-04 | |||
| JP5057409B2 | 2012-10-24 |
Attorney, Agent or Firm:
HASHIMOTO, Kimihide et al. (JP)
Kimihide Hashimoto (JP)
Kimihide Hashimoto (JP)
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