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Title:
PASTE
Document Type and Number:
WIPO Patent Application WO/2022/118470
Kind Code:
A1
Abstract:
A paste containing a metal-element-containing powder, an epoxy-group-containing compound, and a curing agent, the thermal weight loss percentage of the paste after thermal curing thereof at 180°C being 5% or less.

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Inventors:
YONEKURA MOTOKI (JP)
ARIFUKU MOTOHIRO (JP)
URASHIMA KOSUKE (JP)
Application Number:
PCT/JP2020/045278
Publication Date:
June 09, 2022
Filing Date:
December 04, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/00; B22F9/00; H01F1/28
Domestic Patent References:
WO2020075745A12020-04-16
Foreign References:
JPH1135914A1999-02-09
JP2019080058A2019-05-23
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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