Title:
PATCH ANTENNA USING BONDING WIRES FOR FREQUENCY MODULATION
Document Type and Number:
WIPO Patent Application WO/2020/006813
Kind Code:
A1
Abstract:
Disclosed is a patch antenna using bonding wires for frequency modulation. The patch antenna comprises a patch and a bonding wire frequency modulation circuit, wherein the bonding wire frequency modulation circuit is arranged in a radiation slot on one side of the patch, the bonding wire frequency modulation circuit comprises a combination of multiple sets of bonding wires, and the sum of the length of the bonding wire frequency modulation circuit and the length of the patch is equal to the length of the patch antenna. Compared with traditional patch antennas, the patch antenna of the present invention uses a combination of bonding wires for frequency modulation so that the bonding wires become a part of the antenna, and fine modulation for antenna frequency is achieved by means of designing different combinations of bonding wires so that the antenna can have better flexibility.
Inventors:
YUEN SHUN MING (CN)
MUNG WAI YIN (CN)
WU KA MING (CN)
MUNG WAI YIN (CN)
WU KA MING (CN)
Application Number:
PCT/CN2018/100146
Publication Date:
January 09, 2020
Filing Date:
August 13, 2018
Export Citation:
Assignee:
INNOVATION SOUND TECH CO LTD (CN)
International Classes:
H01Q1/38; H01Q5/321
Foreign References:
| US20140253391A1 | 2014-09-11 | |||
| CN107801296A | 2018-03-13 | |||
| CN107548232A | 2018-01-05 | |||
| CN105576363A | 2016-05-11 | |||
| US20060028378A1 | 2006-02-09 | |||
| US6818985B1 | 2004-11-16 |
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