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Title:
PATTERN FORMATION METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/158323
Kind Code:
A1
Abstract:
Provided are: a pattern formation method that includes (1) a step for forming a film using an active light ray-sensitive or radiation-sensitive resin composition that contains a resin (A) which decomposes and undergoes an increase in polarity through the action of an acid and a compound (B) which generates an acid when irradiated with active light rays or radiation, (2) a step for exposing the film to light, and (3) a step for subjecting the exposed film to developing and/or rinsing using an organic treatment liquid that contains butyl acetate and a hydrocarbon having 11 or more carbon atoms, wherein the content of the hydrocarbon having 11 or more carbon atoms in the organic treatment liquid is 1-35 mass%; a pattern formation method in which a pattern having excellent line width in-plane uniformity can be obtained by an electronic device production method that includes the pattern formation method; and an electronic device production method that includes the pattern formation method.

Inventors:
KATO KEITA (JP)
SHIRAKAWA MICHIHIRO (JP)
TAKAHASHI SATOMI (JP)
SHIMIZU TETSUYA (JP)
Application Number:
PCT/JP2022/000432
Publication Date:
July 28, 2022
Filing Date:
January 07, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/20; G03F7/004; G03F7/038; G03F7/039; G03F7/20; G03F7/32
Domestic Patent References:
WO2016017232A12016-02-04
WO2017057225A12017-04-06
WO2016104565A12016-06-30
WO2016158711A12016-10-06
WO2020004306A12020-01-02
WO2018193954A12018-10-25
WO2020066824A12020-04-02
WO2017154345A12017-09-14
WO2020158337A12020-08-06
WO2020158467A12020-08-06
WO2020158366A12020-08-06
WO2020158417A12020-08-06
WO2018019395A12018-02-01
Foreign References:
JP2012203238A2012-10-22
JP2011065105A2011-03-31
JP2014059543A2014-04-03
JP2013061648A2013-04-04
US20160070167A12016-03-10
JP2014098921A2014-05-29
JP2014041327A2014-03-06
US20160070167A12016-03-10
US20150004544A12015-01-01
US20160237190A12016-08-18
US20160274458A12016-09-22
JP2021009169A2021-01-28
JP2021120391A2021-08-19
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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