PATTERN FORMING METHOD, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND LAMINATED BODY

WIPO Patent Application WO/2017/056828

A1

Provided are: a pattern forming method with which film thinning is reduced but high resolution can be achieved, especially when an ultra-fine remainder pattern is formed; a manufacturing method for an electronic device, the manufacturing method including the pattern forming method; and a laminated body for forming the pattern. The pattern forming method includes: (a) a step for forming an actinic ray-sensitive or radiation-sensitive film by using an actinic ray-sensitive or radiation-sensitive composition; (b) a step for forming an upper-layer film on the actinic ray-sensitive or radiation-sensitive film by using an upper-layer film forming composition; (c) a step for exposing the actinic ray-sensitive or radiation-sensitive film having formed thereon the upper-layer film; and (d) a step for developing, by using a developer, the actinic ray-sensitive or radiation-sensitive film that has been exposed, wherein the upper-layer film forming composition contains a crosslinking agent. The manufacturing method for an electronic device includes the pattern forming method. The laminated body includes the actinic ray-sensitive or radiation-sensitive film, and the upper-layer film containing a crosslinking agent.

NIHASHI WATARU (JP)
TSUBAKI HIDEAKI (JP)
TSUCHIHASHI TORU (JP)
YAMAMOTO KEI (JP)

PCT/JP2016/075389

April 06, 2017

August 31, 2016

Click for automatic bibliography generation  

FUJIFILM CORP (JP)

G03F7/11; G03F7/20; G03F7/32; G03F7/38; G03F7/038; G03F7/039

WO2008015969A1

2008-02-07

JP2006184575A	2006-07-13
JP2006064712A	2006-03-09
JP2006023699A	2006-01-26
JP2013109279A	2013-06-06
JP2002006494A	2002-01-09

NAKASHIMA Junko et al. (JP)

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