Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/017232
Kind Code:
A1
Abstract:
This pattern forming method comprises in the following order: a step for forming a film on a substrate using an active light sensitive or radiation sensitive resin composition that contains (A) a resin which has a repeating unit having a phenolic hydroxyl group and a repeating unit having a group that is decomposed by the action of an acid and generates a carboxyl group, and (B) a compound that generates an acid by being irradiated with active light or radiation; a step for exposing the film to light; and a step for developing the light-exposed film using a developer liquid that contains an organic solvent. The developer liquid that contains an organic solvent contains an organic solvent having 8 or more carbon atoms and 2 or less heteroatoms in an amount of 50% by mass or more.

Inventors:
TSUCHIHASHI TORU (JP)
NIHASHI WATARU (JP)
TSUBAKI HIDEAKI (JP)
Application Number:
PCT/JP2015/063709
Publication Date:
February 04, 2016
Filing Date:
May 13, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; G03F7/039; G03F7/32
Foreign References:
JP2014106298A2014-06-09
JP2013080006A2013-05-02
JP2014026265A2014-02-06
JP2014016440A2014-01-30
JP2011170316A2011-09-01
JP2014059543A2014-04-03
JP2014041327A2014-03-06
JP2013257468A2013-12-26
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
Junko Nakajima (JP)
Download PDF: