Title:
PATTERN-FORMING METHOD USING A LASER
Document Type and Number:
WIPO Patent Application WO/2010/113513
Kind Code:
A1
Abstract:
Provided is a patterning method that allows a reduction in the takt time for pattern-forming, allows pattern layers and dielectric layers to be fired together, and enables a reduction in the total cost of pattern-forming. This patterning method includes: a coating process in which a substrate is coated with a paste comprising inorganic powder, a resin containing carboxyl groups, glass frit, and a solvent; a drying process in which the abovementioned paste that has been applied to the substrate is dried, forming a dry film; a laser irradiation process in which a laser is used to draw a pattern on the dry film; and a developing process in which an alkaline solution is used to develop the pattern.
Inventors:
YONEDA NAOKI (JP)
SUZUKI NOBUYUKI (JP)
KAKINUMA MASAHISA (JP)
IKENO JUNICHI (JP)
SUZUKI NOBUYUKI (JP)
KAKINUMA MASAHISA (JP)
IKENO JUNICHI (JP)
Application Number:
PCT/JP2010/002393
Publication Date:
October 07, 2010
Filing Date:
March 31, 2010
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
NAT UNIVERSITY CORP SAITAMA UN (JP)
YONEDA NAOKI (JP)
SUZUKI NOBUYUKI (JP)
KAKINUMA MASAHISA (JP)
IKENO JUNICHI (JP)
NAT UNIVERSITY CORP SAITAMA UN (JP)
YONEDA NAOKI (JP)
SUZUKI NOBUYUKI (JP)
KAKINUMA MASAHISA (JP)
IKENO JUNICHI (JP)
International Classes:
G03F7/36; G03F7/004; G03F7/038; G03F7/38; H01J9/02; H01J9/20; H01J11/22; H01J11/34; H01J11/38; H01J11/44; H01J11/02
Domestic Patent References:
| WO2007007802A1 | 2007-01-18 | |||
| WO2007007800A1 | 2007-01-18 |
Foreign References:
| JP2008146042A | 2008-06-26 | |||
| JP2008146041A | 2008-06-26 | |||
| JP2008233421A | 2008-10-02 | |||
| JP2006128055A | 2006-05-18 | |||
| JPH11338130A | 1999-12-10 |
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)
Patent business corporation Amagi international patent firm (JP)
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