Title:
PATTERN-FORMING METHOD AND PATTERN
Document Type and Number:
WIPO Patent Application WO/2012/137672
Kind Code:
A1
Abstract:
Provided is a pattern-forming method that is well able to form an ultrafine pattern even when applying a photo-curable composition using an inkjet method. The pattern-forming method involves applying a photo-curable composition containing a polymerisable compound and a polymerisation initiator on a base material or on a mold having a fine pattern, and exposing the photo-curable composition to light while the composition is held by the mold or base material. The viscosity of the photo-curable composition at 25° C is 12 to 100 mPa/s. The photo-curable composition is applied to the base material or to the mold having a fine pattern by being discharged in droplets, and the temperature during the discharging of the photo-curable composition is at least 28°C.
Inventors:
KODAMA KUNIHIKO (JP)
KODAMA KENICHI (JP)
KODAMA KENICHI (JP)
Application Number:
PCT/JP2012/058510
Publication Date:
October 11, 2012
Filing Date:
March 30, 2012
Export Citation:
Assignee:
FUJIFILM CORP (JP)
KODAMA KUNIHIKO (JP)
KODAMA KENICHI (JP)
KODAMA KUNIHIKO (JP)
KODAMA KENICHI (JP)
International Classes:
H01L21/027; B29C39/02; C08F220/20
Foreign References:
| JP2009208239A | 2009-09-17 | |||
| JP2007227715A | 2007-09-06 | |||
| JP2007211098A | 2007-08-23 | |||
| JP2005236040A | 2005-09-02 | |||
| JP2010037541A | 2010-02-18 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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Claims:
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