PATTERNED RELEASE LAYERS, AND METHODS OF MAKING AND USING THEM IN DEVICE MANUFACTURING

Title:

PATTERNED RELEASE LAYERS, AND METHODS OF MAKING AND USING THEM IN DEVICE MANUFACTURING

Document Type and Number:

WIPO Patent Application WO/2024/049769

Kind Code:

A3

Abstract:

Patterned assemblies with a patterned release layer, methods of making, and methods of using are described herein. The assemblies with a patterned release layer may include donor plates, wafers, components (e.g. microelectronic components), and combinations thereof. The patterned assemblies may be used for transferring components.

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Inventors:

ROBINSON MATTHEW (US)

Application Number:

PCT/US2023/031304

Publication Date:

April 18, 2024

Filing Date:

August 28, 2023

Export Citation:

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Assignee:

TERECIRCUITS CORP (US)

International Classes:

H01L21/683

Foreign References:

US20190189496A1

2019-06-20

Attorney, Agent or Firm:

LOZAN, Vladimir Sergey (US)

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