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Title:
PATTERNING METHOD, FILM FORMING METHOD, PATTERNING DEVICE, FILM FORMING DEVICE, ELECTRO−OPTIC DEVICE AND PRODUCTION METHOD THEREFOR, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2003/026359
Kind Code:
A1
Abstract:
A novel patterning method improved in degree of freedom in material selection, a film forming method, a patterning device, a film forming device, an electro−optic device and a production method therefor, an electronic apparatus, an electronic device and a production method therefor. A patterning device (1) comprising a vacuum chamber (2) controllable to a high degree of vacuum, a nozzle (3) connected to a material supply source (7) and mounted to the vacuum chamber (2), for supplying materials from the material supply source (7) into the vacuum chamber (2), and a substrate stage (4) provided in the chamber (2), for holding and fixing a substrate (S), a moving mechanism (11) being provided to the nozzle (3) or the substrate stage (4) to relatively move their positions. Ideally, it is preferable to generate a free jet of material molecules to effect patterning (free jet patterning) using this free jet. Accordingly, a high−accuracy patterning is made available.

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Inventors:
MIYAZAWA TAKASHI
Application Number:
PCT/JP2002/009383
Publication Date:
March 27, 2003
Filing Date:
September 12, 2002
Export Citation:
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Assignee:
SEIKO EPSON CORP (JP)
International Classes:
H05B33/10; B05C5/00; B05C9/08; B05C15/00; C23C14/04; H01L51/40; H01L51/50; H05B33/14; H01L27/32; H01L51/00; H01L51/30; (IPC1-7): H05B33/10; H05B33/14; B41J2/01
Foreign References:
JP2001219400A2001-08-14
JPH09246161A1997-09-19
JPH10202153A1998-08-04
JPH07252670A1995-10-03
JP2000323276A2000-11-24
JPH06306181A1994-11-01
JPH06267940A1994-09-22
Other References:
See also references of EP 1427262A4
Attorney, Agent or Firm:
Kamiyanagi, Masataka c/o Intellectual Property Division SEIKO EPSON CORPORATION 3-5 (Owa 3-Chome Suwa-Shi, Nagano, JP)
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