Title:
Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/1983/003163
Kind Code:
A1
Abstract:
A Pb alloy solder which contains 1 to 65 % by weight of one or both of Sn and In, the residue being composed of Pb and unavoidable impurities, with less than 50 ppb of radioisotopes as unavoidable impurities, so that a count of the number of radioactive alpha particles is less than 0.5 CPH/cm2, thereby providing excellent bonding strength and wettability. 1 to 10 % of Ag is also added to this solder to further improve the properties of the solder.
Inventors:
HOSODA NAOYUKI (JP)
UCHIYAMA NAOKI (JP)
KAWANAKA RYUUSUKE (JP)
UCHIYAMA NAOKI (JP)
KAWANAKA RYUUSUKE (JP)
Application Number:
PCT/JP1983/000065
Publication Date:
September 15, 1983
Filing Date:
March 02, 1983
Export Citation:
Assignee:
MITSUBISHI METAL CORP (JP)
MITSUBISHI ELECTRIC CORP (JP)
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C22C11/00; B23K35/26; C22C13/00; C22C28/00; H01L21/52; H01L21/58; H01L23/02; H01L23/10; H01L23/14; H01L23/488; (IPC1-7): H01L21/58; B23K35/26; H01L23/02
Foreign References:
| JPS5734352A | 1982-02-24 |
Other References:
DENSHI GIJUTSU, Vol. 23, No. 7, June, 1981 (Tokyo) ARINO YASUZO and two others, "Handotai Assembly yo Solder" p. 90 - 94
See also references of EP 0103025A4
See also references of EP 0103025A4
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