Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PCB COOLING APPARATUS, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/224254
Kind Code:
A1
Abstract:
A PCB cooling apparatus, for cooling a PCB by contacting one surface of the PCB, according to the present invention, comprises: a base member; a channel provided in the base member to allow a cooling medium to flow; an inlet provided in the base member to introduce the cooling medium into the channel; an outlet provided in the base member to discharge the cooling medium from the channel; a cover member coupled to the base member so as to be able to cover the channel; and a nickel plating layer provided on the inner surface of the base member and one surface of the cover member so as to surround the channel.

More Like This:
WO/2019/209800FLUID RESPONSIVE DEVICES AND METHODS
JP5507120Portable electronic devices and mobile electronic device control methods
Inventors:
CHO IN HYUN (KR)
Application Number:
PCT/KR2023/004401
Publication Date:
November 23, 2023
Filing Date:
March 31, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEW V TECH CO LTD (KR)
International Classes:
H05K7/20; H01L23/473
Domestic Patent References:
WO2014171276A12014-10-23
Foreign References:
JP2002315358A2002-10-25
JP2013149920A2013-08-01
KR102379673B12022-03-28
KR20140015489A2014-02-06
Attorney, Agent or Firm:
SEO, Jae Sung (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ELECTRONIC DEVICE FOR PERFORMING OPERATION IN RESPONSE TO OVERHEATED STATE AND OPERATING METHOD THER...

Next Patent: CHUCK FOR WAFER AND METHOD FOR MANUFACTURING SAME