PCB INCLUDING CONNECTOR AND GROUNDS WITH DIFFERENT POTENTIALS, AND ELECTRONIC DEVICE HAVING THE SAME

Title:

PCB INCLUDING CONNECTOR AND GROUNDS WITH DIFFERENT POTENTIALS, AND ELECTRONIC DEVICE HAVING THE SAME

Document Type and Number:

WIPO Patent Application WO/2018/182207

Kind Code:

A1

Abstract:

An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.

Inventors:

KIM HYUNG JOON (KR)
KIM MIN-SEOK (KR)
KIM SIGWAN (KR)
KIM JUNG-WOO (KR)

Application Number:

PCT/KR2018/002914

Publication Date:

October 04, 2018

Filing Date:

March 13, 2018

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K1/02; H01R12/72; H01R13/652; H05K5/00

Foreign References:

US20090219239A1	2009-09-03
US20030123238A1	2003-07-03
JP2006286894A	2006-10-19
US20160344120A1	2016-11-24
US20150171562A1	2015-06-18

Other References: