Title:
PCB INCLUDING A STAR SHAPED THROUGH-HOLE SOLDER PAD
Document Type and Number:
WIPO Patent Application WO2005122655
Kind Code:
A3
Abstract:
The present invention relates to a printed circuit board (400, 500) comprising a through hole for a leaded component (412). A surface of the printed circuit board around the hole comprises a solder-pad (202, 406) having a shape with a varying radius around the center of the through hole. The solder-pad of printed circuit board (400, 500) is suitable for in a reflow soldering process. The solder pad shape is a star having at least two arms. The present invention also comprises a method that includes applying solder paste to the solder-pad (202, 406), mounting a leaded component (412) on the printed circuit board (400, 500) having a through hole with a solder pad (202, 406) having a shape with a varying radius and reflow soldering the printed circuit board (400, 500).
Inventors:
SCHULZ ARMIN (DE)
Application Number:
PCT/IB2005/051797
Publication Date:
March 16, 2006
Filing Date:
June 02, 2005
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
SCHULZ ARMIN (DE)
SCHULZ ARMIN (DE)
International Classes:
H05K1/11; H05K3/30; H05K3/34; (IPC1-7): H05K3/34; H05K3/30
Foreign References:
| US20040020972A1 | 2004-02-05 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 04 30 April 1997 (1997-04-30)
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 03 27 February 1998 (1998-02-27)
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 03 27 February 1998 (1998-02-27)
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