Title:
PCB LAMINATED STRUCTURE AND MOBILE TERMINAL COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/194346
Kind Code:
A1
Abstract:
The present invention relates to a PCB laminated structure comprising: a first substrate on which an electronic device is mounted; a second substrate disposed to vertically overlap the first substrate; and an interposer assembly installed between the first substrate and the second substrate and enabling electromagnetic connection between the first and second substrates, wherein the interposer assembly comprises: a housing configured to form a closed region along the upper surface circumference of the first substrate and the lower surface circumference of the second substrate, and support the first and second substrates; a signal via connected to each of the first and second substrates so as to transfer an electromagnetic signal between the first substrate and the second substrate; and a ground via connected to the housing so as to function as grounding and disposed at one side of the signal via while being spaced a predetermined distance apart from the signal via.
Inventors:
KIM JAEHYUK (KR)
PAEK KYUNGCHEOL (KR)
LIM CHAEJOO (KR)
PAEK KYUNGCHEOL (KR)
LIM CHAEJOO (KR)
Application Number:
PCT/KR2018/005153
Publication Date:
October 10, 2019
Filing Date:
May 03, 2018
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
H05K1/11; H04M1/02; H05K1/02
Foreign References:
| KR101798918B1 | 2017-11-17 | |||
| US20180070484A1 | 2018-03-08 | |||
| US20170229775A1 | 2017-08-10 | |||
| US20090268423A1 | 2009-10-29 | |||
| US20050168961A1 | 2005-08-04 |
Attorney, Agent or Firm:
PARK, Jang-Won (KR)
Download PDF: