Title:
PCB SPEAKER AND METHOD FOR MICROMACHINING SPEAKER DIAPHRAGM ON PCB SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/029359
Kind Code:
A1
Abstract:
A PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate (S110); providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate (S120); providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer (S130); and releasing the sacrificial layer and the diaphragm layer remains (S140).
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Inventors:
ZOU QUANBO (CN)
Application Number:
PCT/CN2014/085207
Publication Date:
March 03, 2016
Filing Date:
August 26, 2014
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R19/02; H04R7/14
Foreign References:
| CN102685655A | 2012-09-19 | |||
| CN103313172A | 2013-09-18 | |||
| CN103209377A | 2013-07-17 | |||
| CN103686567A | 2014-03-26 | |||
| US20140133687A1 | 2014-05-15 | |||
| US20060148137A1 | 2006-07-06 |
Attorney, Agent or Firm:
BEIJING GRANDER IP LAW FIRM (East Wing Hanwei Plaza,No.7 Guanghua Road, Chaoyang District, Beijing 0, CN)
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