Title:
PEELING METHOD, SUPPORTING SUBSTRATE WITH ADHESIVE LAYER, AND PEELING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/141385
Kind Code:
A1
Abstract:
Disclosed is a method for peeling, in synchronization with rotation of a roller, an elastic film adhered to a supporting substrate, while having the elastic film in close contact with a part of a surface of the roller. A first tensile force is applied to the elastic film, said first tensile force being applied in the roller rotation direction in which the elastic film is peeled, and at a position where the elastic film is peeled, a force is applied to the supporting substrate in the direction in which the elastic film is peeled, thereby applying a second tensile force to the elastic film.
Inventors:
MIYASHITA YOTA (JP)
YUYA SHIGENORI (JP)
YUYA SHIGENORI (JP)
Application Number:
PCT/JP2015/054792
Publication Date:
September 24, 2015
Filing Date:
February 20, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/683; B65H41/00; H01L21/02
Foreign References:
| JP2005335880A | 2005-12-08 | |||
| JP2014141065A | 2014-08-07 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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