Title:
PEELING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/106460
Kind Code:
A1
Abstract:
Disclosed is a peeling method for peeling an adhesive material, which has been bonded to an adherend, from the adherend, wherein: the adhesive material is bonded to the adherend with an adhesive layer being interposed therebetween; the glass transition temperature Tg1 of the entire adhesive layer is 12°C or less; and the adhesive material is peeled off from the adherend by cooling the adhesive layer to a temperature that is higher than the glass transition temperature Tg1 by 5°C or less in a state where the adhesive material is bonded to the adherend with the adhesive layer being interposed therebetween.
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Inventors:
HASHIMOTO YUSUKE (JP)
KAWAI KEN (JP)
TAKEYA NOBUYUKI (JP)
MATSUBARA KEISUKE (JP)
KAWAI KEN (JP)
TAKEYA NOBUYUKI (JP)
MATSUBARA KEISUKE (JP)
Application Number:
PCT/JP2023/041069
Publication Date:
May 23, 2024
Filing Date:
November 15, 2023
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J5/00; B32B43/00; C09J7/38; C09J11/08; C09J133/06; C09J201/00
Domestic Patent References:
| WO2014091927A1 | 2014-06-19 |
Foreign References:
| JP2012193264A | 2012-10-11 | |||
| JPS5774377A | 1982-05-10 | |||
| US20190210351A1 | 2019-07-11 | |||
| JP2013173913A | 2013-09-05 | |||
| JP2019112574A | 2019-07-11 | |||
| JP2022052317A | 2022-04-04 |
Other References:
遠山三夫, 感圧接着剤(粘着剤) -その機能と仕組み-, 第1版, (株)高分子刊行会, 20 February 1991, pp. 78-80, ISBN 4-7702-0052-8/特に参照すべき箇所, p. 79, fig. 85, p. 80, lines 3-6, non-official translation (TOYAMA, Mitsuo, Pressure sensitive adhesive (adhesive) - its function and mechanism -, first edition, KOBUNSHI PUBLISHING CO., LTD., particularly, points to refer)
Attorney, Agent or Firm:
YAMADA, Tsuyoshi (JP)
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