Title:
PERFORATED BASE BOARD PRODUCTION METHOD AND PERFORATED BASE BOARD PRODUCTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/124097
Kind Code:
A1
Abstract:
The objective of the invention is to efficiently form minute holes in a base board. In one aspect, the perforated base board production method comprises: a depositing step of injecting a metal disposed in a portion of the base board surface into the base board through the application of a voltage, and depositing the injected metal within the base board through the application of a voltage that is identical to or different from the previously applied voltage; and a hole-forming step of melting by etching the metal deposited within the base board, thereby forming the hole in the base board.
Inventors:
MATSUSAKA SOUTA (JP)
AOYAMA HIROKI (JP)
KODAKA HIROKI (JP)
KAWAMURA HIROFUMI (JP)
AOYAMA HIROKI (JP)
KODAKA HIROKI (JP)
KAWAMURA HIROFUMI (JP)
Application Number:
PCT/JP2017/046710
Publication Date:
July 05, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
UNIV CHIBA NAT UNIV CORP (JP)
USHIO ELECTRIC INC (JP)
USHIO ELECTRIC INC (JP)
International Classes:
C03B33/02; C03C15/00; C03C21/00; C23F1/18; C23F1/30; H01L21/306; H01L21/308
Foreign References:
| JP2011170312A | 2011-09-01 | |||
| JP2000313629A | 2000-11-14 |
Attorney, Agent or Firm:
KONISHI, Kay et al. (JP)
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