PERMANENT ADHESIVE COMPOSITION FOR IMAGE SENSORS, AND BONDING METHOD AND LAMINATE USING SAME

WIPO Patent Application WO/2017/110916

A1

Provided are a permanent adhesive composition for image sensors which provides an adhesive layer having excellent heat resistance and thermal shock resistance, and a bonding method and laminate using the permanent adhesive composition. The permanent adhesive composition for image sensors according to the present invention is characterized by containing (A) a thermosetting or photocurable resin containing a specific bifunctional (meth)acrylic acid ester-derived structural unit, (B) a polymerizable monomer, and (C) an antioxidant, and is for bonding together a substrate and a support for the substrate. The bonding method according to the present invention is characterized by comprising a bonding step for bonding together a substrate and a support for the substrate using the permanent adhesive composition. The laminate according to the present invention is characterized by being provided with a substrate, a support for the substrate, and an adhesive layer for bonding the substrate and the support together, wherein the adhesive layer is formed of the permanent adhesive composition.

YAMADAYA TOKUNORI (JP)
TAKEUCHI HIROAKI (JP)
MAEDA MASATOSHI (JP)
HAYASHI KENTARO (JP)
ISOZAKI MASAYOSHI (JP)

PCT/JP2016/088198

June 29, 2017

December 21, 2016

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TOKYO OHKA KOGYO CO LTD (JP)
NIPPON STEEL & SUMIKIN CHEM CO (JP)

C09J133/04; B32B7/12; C09J4/02; C09J11/06; H01L27/14

JP2009176941A	2009-08-06
JP2010261026A	2010-11-18
JP2015140408A	2015-08-03
JP2003277712A	2003-10-02
JP2014105316A	2014-06-09
JP2016044268A	2016-04-04

SHOBAYASHI, Masayuki (JP)

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