Title:
PHENOL RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED PRODUCTS TEHREOF, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2011/096273
Kind Code:
A1
Abstract:
Provided is a curable resin composition which can yield cured products with excellent heat resistance and flame retardance and which, when used in a printed wiring board, ensures excellent interlaminar bond strength. The curable resin composition can be attained by using, as the curing agent for an epoxy resin, a phenol resin composition which comprises a naphthol novolak resin (a1) represented by general formula (1) [wherein R1 and R2 are each independently a hydrogen atom, alkyl, or alkoxy; and n represents the number of repeating units and is an integer of 1 or more] and a compound (a2) represented by general formula (2) [wherein R1 and R2 are each independently a hydrogen atom, alkyl, or alkoxy]. In the phenol resin composition, the total content of compounds of general formula (1) wherein n = 1 and compounds thereof wherein n = 2 is 10 to 35%; the average of n's is 3.0 to 7.0; and the content of the compound (a2) is 1 to 6%.
Inventors:
SATOU YUTAKA (JP)
ARITA KAZUO (JP)
OGURA ICHIROU (JP)
ARITA KAZUO (JP)
OGURA ICHIROU (JP)
Application Number:
PCT/JP2011/050827
Publication Date:
August 11, 2011
Filing Date:
January 19, 2011
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
SATOU YUTAKA (JP)
ARITA KAZUO (JP)
OGURA ICHIROU (JP)
SATOU YUTAKA (JP)
ARITA KAZUO (JP)
OGURA ICHIROU (JP)
International Classes:
C08L61/10; C08G8/10; C08J5/24; H05K1/03
Foreign References:
| JP2007031527A | 2007-02-08 | |||
| JPH04279627A | 1992-10-05 | |||
| JPH04323214A | 1992-11-12 | |||
| JP2001261786A | 2001-09-26 | |||
| JP2007031527A | 2007-02-08 | |||
| JPH07215902A | 1995-08-15 |
Other References:
See also references of EP 2532710A4
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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Claims: