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Patent Searching and Data


Title:
PHENOL RESIN FOR PHOTORESIST, PHOTORESIST COMPOSITION CONTAINING SAME, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/050592
Kind Code:
A1
Abstract:
Disclosed is a phenol resin for photoresists, which enables high resolution, while having high flexibility, high heat resistance and high sensitivity.  Also disclosed are a photoresist composition containing the phenol resin for photoresists, and a method for producing the phenol resin for photoresists. The phenol resin for photoresists is characterized by being obtained by condensing (a) a methyl phenol containing at least one of meta-cresol and para-cresol, and (b) a dialdehyde containing at least one of glutaraldehyde and adipaldehyde.

Inventors:
YAMASAKI HIROHITO (JP)
ISHIGUCHI KOUJI (JP)
Application Number:
PCT/JP2009/068688
Publication Date:
May 06, 2010
Filing Date:
October 30, 2009
Export Citation:
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Assignee:
INST NAT COLLEGES TECH JAPAN (JP)
MEIWA PLASTIC IND LTD (JP)
YAMASAKI HIROHITO (JP)
ISHIGUCHI KOUJI (JP)
FURUMOTO TAKAHISA (JP)
International Classes:
C08G8/04; G03F7/023; H01L21/027
Foreign References:
JPH03199221A1991-08-30
JPS5765716A1982-04-21
JPH03501268A1991-03-22
JPH0656949A1994-03-01
JP2001048959A2001-02-20
JP2006509889A2006-03-23
Attorney, Agent or Firm:
ITAMI, Masaru et al. (JP)
Itami 勝 (JP)
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