Title:
PHENOLIC HYDROXYL GROUP-CONTAINING RESIN AND RESIST MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/066372
Kind Code:
A1
Abstract:
The purpose of the invention is to provide: a phenolic hydroxyl group-containing resin that has excellent flowability and provides excellent heat resistance and dry etching resistance in a cured product; and a curable composition and a resist material containing said resin. Provided is a phenolic hydroxyl group-containing resin which is a reaction product of a bisnaphthol compound (a1) represented by structural formula (1) (wherein X represents a C1-14 hydrocarbon group, R1s each independently represent an aliphatic hydrocarbon group, an alkoxy group, a halogen atom, an aryl group or an aralkyl group, m is 0, 1 or 2, and n is an integer of 0 or 1 to 4) and a cyanuric halide (a2), the phenolic hydroxyl group-containing resin having a polydispersity (Mw/Mn) within a range from 1.01 to 1.30.
Inventors:
IMADA TOMOYUKI (JP)
NAGAE NORIO (JP)
NAGAE NORIO (JP)
Application Number:
PCT/JP2017/034062
Publication Date:
April 12, 2018
Filing Date:
September 21, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/36; C07D251/34; C08G65/34; G03F7/032
Domestic Patent References:
| WO2005114331A1 | 2005-12-01 |
Foreign References:
| JP2001335569A | 2001-12-04 | |||
| JP2002012588A | 2002-01-15 | |||
| JP2009013169A | 2009-01-22 | |||
| JP2012219090A | 2012-11-12 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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