Title:
PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2020/129724
Kind Code:
A1
Abstract:
The present invention provides: an epoxy resin composition which exhibits excellent low dielectric characteristics, while exhibiting excellent copper foil peel strength and interlayer adhesion strength in printed wiring board applications; and a phenolic resin and an epoxy resin, which enable the achievement of this epoxy resin composition. A phenolic resin which is represented by general formula (1). In the formula, R1 represents a hydrocarbon group having 1-10 carbon atoms; R2 represents a hydrogen atom or a group of formula (1a) or formula (1b), with at least one of the R2 moieties being a group of formula (1a) or formula (1b); and n represents the number of repetitions, which is a number of 0-5.
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Inventors:
SOH MASAHIRO (JP)
ISHIHARA KAZUO (JP)
LEE JIN SOO (KR)
KIM JAE IL (KR)
JEE JOONG HWI (KR)
YU KI HWAN (KR)
ISHIHARA KAZUO (JP)
LEE JIN SOO (KR)
KIM JAE IL (KR)
JEE JOONG HWI (KR)
YU KI HWAN (KR)
Application Number:
PCT/JP2019/048051
Publication Date:
June 25, 2020
Filing Date:
December 09, 2019
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
KUKDO CHEMICAL CO LTD (KR)
KUKDO CHEMICAL CO LTD (KR)
International Classes:
C08G59/02; C08G59/62; C08G61/02; C08J5/24
Foreign References:
| JPS4822538B1 | 1973-07-06 | |||
| JPS4114099B1 | 1966-08-06 | |||
| JP2009102456A | 2009-05-14 | |||
| JP2009540081A | 2009-11-19 | |||
| JP2004277708A | 2004-10-07 | |||
| JPH08179502A | 1996-07-12 | |||
| JPH06157680A | 1994-06-07 | |||
| JPS5443259A | 1979-04-05 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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