Title:
PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/234776
Kind Code:
A1
Abstract:
Provided is a phenolic resin which is a reaction product of a catechol compound with an ortho-xylylene-skeleton-containing compound, the phenolic resin being characterized by having a catechol skeleton derived from the catechol compound and an ortho-xylylene skeleton derived from the ortho-xylylene-skeleton-containing compound. A cured article which is produced using an epoxy resin produced using the phenolic resin can exhibit high heat resistance and high flexural properties (including flexural strength, a flexural modulus and others), and is therefore used suitably in a fiber-reinforced composite material and a fiber-reinforced resin molded article.
Inventors:
ONDA SHINJI (JP)
MORINAGA KUNIHIRO (JP)
MORINAGA KUNIHIRO (JP)
Application Number:
PCT/JP2022/018353
Publication Date:
November 10, 2022
Filing Date:
April 21, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/06; C08G61/10; C08J5/04; C08K7/02; C08L63/04
Domestic Patent References:
WO2007007827A1 | 2007-01-18 |
Foreign References:
JP2002226559A | 2002-08-14 | |||
JP2008189708A | 2008-08-21 | |||
JP2016190891A | 2016-11-10 | |||
JP2003201388A | 2003-07-18 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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