Title:
PHENOXY(METH)ACRYLATE RESIN, COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING PHENOXY(METH)ACRYLATE RESIN
Document Type and Number:
WIPO Patent Application WO/2023/210628
Kind Code:
A1
Abstract:
Provided is a phenoxy(meth)acrylate resin which can form cured objects having excellent flexibility and inhibited from having warpage due to cure shrinkage. The phenoxy(meth)acrylate resin comprises a structure represented by formula (1) and a structure represented by formula (2). (In formula (1), R1 is a C10-C18 hydrocarbon group and l is an integer of 1-10.) (In formula (2), X is a C1-C10 divalent linking group derived from a hydrocarbon, R1 is a C10-C18 hydrocarbon group, R2 is a hydrogen atom or a methyl group, and m is an integer of 1-10.)
Inventors:
TAKEDA AKIHIRO (JP)
HISANAGA YOSHIHIRO (JP)
YOKOYAMA YUKA (JP)
YASUI TATSUYA (JP)
HISANAGA YOSHIHIRO (JP)
YOKOYAMA YUKA (JP)
YASUI TATSUYA (JP)
Application Number:
PCT/JP2023/016251
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
SAKATA INX CORP (JP)
International Classes:
C08F2/50; C08F8/00; C08F299/02; C08G59/18
Domestic Patent References:
WO2013058324A1 | 2013-04-25 |
Foreign References:
CN112029381A | 2020-12-04 | |||
JP2021521162A | 2021-08-26 | |||
JP2020510736A | 2020-04-09 | |||
JP2021075720A | 2021-05-20 | |||
JP2022500544A | 2022-01-04 | |||
CN110079047A | 2019-08-02 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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