Title:
PHOSPHORUS-CONTAINING EPOXY RESIN, RESIN COMPOSITION, CURED PRODUCT, LAMINATED BOARD FOR ELECTRIC/ELECTRONIC CIRCUITS, AND METHOD FOR PRODUCING PHOSPHORUS-CONTAINING EPOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2022/255122
Kind Code:
A1
Abstract:
Provided are: a phosphorus-containing epoxy resin having exceptional flame retardancy and solubility; a resin composition containing said phosphorus-containing epoxy resin and a curing agent; a cured product of the resin composition, the cured product having exceptional heat resistance and strength; and a laminated board for electric/electronic circuits. This phosphorus-containing epoxy modified epoxy resin is represented by formula (1), and has an epoxy equivalent weight of at least 300 and less than 5,000 and a phosphorus content of 1-6 mass%. In the formula, X are divalent groups and have at least a phosphorus-containing divalent group represented by formula (2). Each Y independently is a hydrogen atom, a C2-20 acyl group, or a glycidyl group. Z are C2-20 acyl groups or hydrogen atoms, and 5 mol% or more being acyl groups. n is the average number of repetitions, and is greater than 0 and no greater than 30.
Inventors:
AKIBA KEITA (JP)
SATO HIROSHI (JP)
SATO HIROSHI (JP)
Application Number:
PCT/JP2022/020887
Publication Date:
December 08, 2022
Filing Date:
May 19, 2022
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G59/14; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021193273A1 | 2021-09-30 |
Foreign References:
| JP2000309623A | 2000-11-07 | |||
| JPH10168287A | 1998-06-23 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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