Title:
PHOTOCURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/038366
Kind Code:
A1
Abstract:
Provided is a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without leaving a gap therebetween. The photocurable adhesive composition comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000-100,000, (B) 5-70 parts by mass of a phenoxy resin, and (C) 0.1-10 parts by mass of a photopolymerization initiator. The adhesive composition is characterized in that the uncured composition has a loss tangent (loss modulus/storage modulus) at 25ºC less than 1 and that the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80ºC or lower.
Inventors:
NEMOTO TAKASHI (JP)
ARAI YOSHIHIDE (JP)
HORIE KENICHI (JP)
ARAI YOSHIHIDE (JP)
HORIE KENICHI (JP)
Application Number:
PCT/JP2009/004580
Publication Date:
April 08, 2010
Filing Date:
September 14, 2009
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
NEMOTO TAKASHI (JP)
ARAI YOSHIHIDE (JP)
HORIE KENICHI (JP)
NEMOTO TAKASHI (JP)
ARAI YOSHIHIDE (JP)
HORIE KENICHI (JP)
International Classes:
C09J175/14; C09J7/10; C09J11/06; C09J171/10; G02F1/1333
Foreign References:
| JPH11238538A | 1999-08-31 | |||
| JP2001163931A | 2001-06-19 | |||
| JP2009120683A | 2009-06-04 |
Attorney, Agent or Firm:
HIRAYAMA, KIYOTAKA (JP)
Kiyotaka Hirayama (JP)
Kiyotaka Hirayama (JP)
Download PDF: