Title:
PHOTOCURABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/074555
Kind Code:
A1
Abstract:
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet, wherein the ratio of a surface hardness H2 at 25°C, as measured by nano-indentation, at a location 100 μm away from a cut edge produced by laser cutting the photocurable adhesive sheet (S) to the inside of the photocurable adhesive sheet (S) in the planar direction, to a surface hardness H1 at 25°C, as measured by nano-indentation, is 1 to 1.5, inclusive.
Inventors:
SHIMIZU YOSUKE (JP)
SHIMOKURI TAIKI (JP)
OHARA HIROTAKA (JP)
NONAKA TAKAHIRO (JP)
SHIMOKURI TAIKI (JP)
OHARA HIROTAKA (JP)
NONAKA TAKAHIRO (JP)
Application Number:
PCT/JP2022/039266
Publication Date:
May 04, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J4/02; C09J7/38; C09J201/00
Domestic Patent References:
| WO2016117045A1 | 2016-07-28 |
Foreign References:
| JP2017141442A | 2017-08-17 | |||
| JP2019112505A | 2019-07-11 | |||
| JP2016155981A | 2016-09-01 | |||
| JP2021091117A | 2021-06-17 | |||
| JP2020186312A | 2020-11-19 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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