PHOTOCURABLE COMPOSITION AND METHOD FOR PRODUCING MOLDED ARTICLE HAVING SURFACE MICROPATTERN

Title:

PHOTOCURABLE COMPOSITION AND METHOD FOR PRODUCING MOLDED ARTICLE HAVING SURFACE MICROPATTERN

Document Type and Number:

WIPO Patent Application WO/2010/090269

Kind Code:

A1

Abstract:

Provided is a photocurable composition, which is capable of forming a cured product having excellent environmental properties and mold release performance and has excellent compatibility with fluorosurfactants and other components. Also provided is a method with which it is possible to produce a molded article having a surface micropattern obtained by precise transfer of a mold inverted pattern and having a uniform surface composition. A photocurable composition for imprinting comprises as the primary component a compound having one or more acryloyloxy or methacryloyloxy groups. The photocurable composition contains polymer (D). Polymer (D) is a polymer having a mass-average molecular weight of 1,000 to 5,000 and contains 20 to 45 mass% of ＣＨ２=Ｃ(Ｒ１１)-Ｃ(Ｏ)Ｏ-Ｑ-Ｒｆ units, 20 to 65 mass% of ＣＨ２=Ｃ(Ｒ２１)-Ｃ(Ｏ)Ｏ-(ＣＨ２ＣＨ(Ｒ２２)Ｏ)ｎ-Ｈ units (number-average molecular weight of 350 or less), and 5 to 40 mass% of ＣＨ２=Ｃ(Ｒ３１)-Ｃ(Ｏ)Ｏ-Ｒ３２ units. R11, R21, and R31 are hydrogen atoms or methyl groups, Q is a bivalent linking group, or the like, Rf is a C1-6 polyfluoroalkyl group, R22 is a hydrogen atom, or the like, n is between 3 and 6, and R32 is a C2-15 aliphatic hydrocarbon group.

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Inventors:

FUJIE AYAKO (JP)
KAWAGUCHI YASUHIDE (JP)
NAKAYAMA FUMIKO (JP)

Application Number:

PCT/JP2010/051634

Publication Date:

August 12, 2010

Filing Date:

February 04, 2010

Export Citation:

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Assignee:

ASAHI GLASS CO LTD (JP)
FUJIE AYAKO (JP)
KAWAGUCHI YASUHIDE (JP)
NAKAYAMA FUMIKO (JP)

International Classes:

H01L21/027; B29C59/02; C08F220/28; B29K33/04

Domestic Patent References:

WO2006114958A1

2006-11-02

Foreign References:

JP2006182880A	2006-07-13
JP2006114882A	2006-04-27
JP2004523906A	2004-08-05
JP2004071934A	2004-03-04
JP2004051790A	2004-02-19
JP2002012796A	2002-01-15
JP2001106710A	2001-04-17

Attorney, Agent or Firm:

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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