Title:
PHOTOCURABLE COMPOSITION FOR NAILS OR ARTIFICIAL NAILS
Document Type and Number:
WIPO Patent Application WO/2024/095924
Kind Code:
A1
Abstract:
[Problem] To provide a photocurable composition for nails or artificial nails that suppresses heat generation, that achieves both storage stability and photocurability, and that exhibits luster on a surface of a cured product thereof. [Solution] A photocurable composition for nails or artificial nails which comprises components (A)-(D), said photocurable composition containing 30-70 parts by mass of component (B) and 10-80 parts by mass of component (C) with respect to 100 parts by mass of component (A). Component (A) is a urethane-modified (meth)acrylate oligomer having a weight-average molecular weight of 3,000-6,000 and including three to five (meth)acryloyl groups per molecule. Component (B) is a (meth)acrylate (excluding component (A)) including one or more (meth)acryloyl groups per molecule. Component (C) is a polythiol compound. Component (D) is a photoinitiator.
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Inventors:
MORIKAWA YUMI (JP)
HARADA NATSUMI (JP)
HARADA NATSUMI (JP)
Application Number:
PCT/JP2023/038945
Publication Date:
May 10, 2024
Filing Date:
October 27, 2023
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
A61K8/81; A45D31/00; A61K8/46; A61K8/55; A61Q3/02
Domestic Patent References:
| WO2022163248A1 | 2022-08-04 | |||
| WO2014061687A1 | 2014-04-24 |
Foreign References:
| JP2022041419A | 2022-03-11 |
Attorney, Agent or Firm:
IBC (JP)
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