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Title:
PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/244450
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive which has flexibility suitable for both adhesion and conformability to adherend surfaces and can form highly reliable joints having a high refractive index. The pressure-sensitive adhesive is a photocurable pressure-sensitive adhesive comprising: an acrylic polymer (A) including a monomer unit derived from an aromatic-ring-containing monomer (m1); a high-refractive-index monomer (h1) having a carbon-carbon double bond; and a photoinitiator. The photocurable pressure-sensitive adhesive has a refractive index of 1.560 or greater after having been photocured.

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Inventors:
NISHINO TOMOYA (JP)
KATAOKA KENICHI (JP)
Application Number:
PCT/JP2022/013328
Publication Date:
November 24, 2022
Filing Date:
March 23, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; B32B7/023; B32B27/16; B32B27/20; B32B27/30; C09J7/38; C09J11/06; C09J133/00; G02B5/30
Domestic Patent References:
WO2021193719A12021-09-30
Foreign References:
JP2020132875A2020-08-31
JP2006342258A2006-12-21
JP2012021148A2012-02-02
JP2011168773A2011-09-01
JP2013018937A2013-01-31
Attorney, Agent or Firm:
OI, Michiko (JP)
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