PHOTOCURABLE RESIN COMPOSITION CONTAINING FLUORINE AND METHOD FOR PRODUCING A RESIN MOLD USING SAME

WIPO Patent Application WO/2011/007979

A2

The present invention relates to a photocurable resin composition containing fluorine and to a method for producing a mold including the composition. More particularly, as opposed to conventional polymer resin materials used for a resin mold, the photocurable resin composition of the present invention is not only easily wetted with and released from a thermosetting or photocurable resin for forming a pattern, regardless of whether or not an additional surface treatment is performed, but also has chemical resistance, mechanical properties, high transmittance, etc. The present invention also provides a resin mold using the composition.

JP5880484	Polyurethane- (meth) acrylic polymer composite resin aqueous dispersion, aqueous coating and laminate
WO/2004/018558	IMPACT-RESISTANT POLYOXYMETHYLENE MOULDING COMPOUNDS, USE THEREOF AND MOULDING COMPOUNDS PRODUCED THEREFROM

YOO JAE-WON (KR)
KIM BYUNG-UK (KR)
KIM UN-YONG (KR)
KWAK EUN-JIN (KR)

PCT/KR2010/004418

January 20, 2011

July 07, 2010

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DONGJIN SEMICHEM CO LTD (KR)
YOO JAE-WON (KR)
KIM BYUNG-UK (KR)
KIM UN-YONG (KR)
KWAK EUN-JIN (KR)

C08L75/04; B29C39/00; C08K5/00; C08L33/16

KR20090084340A	2009-08-05
US20100009137A1	2010-01-14
JP2006523728A	2006-10-19
US20080176049A1	2008-07-24
KR20080101584A	2008-11-21
KR20070031858A	2007-03-20

WON, YOUNG-HO (KR)
원영호 (KR)

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