Title:
PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT, RESIN SHAPED ARTICLE AND METHOD FOR PRODUCING MOLD
Document Type and Number:
WIPO Patent Application WO/2022/097667
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photocurable resin composition which is reduced in soot residue during the production of a mold, while being suppressed in the occurrence of a crack or breaking. The present invention has solved the above-described problem by the founding such that soot residue during the production of a mold is suppressed by a photocurable resin composition which is characterized by containing a (meth)acrylate-based ultraviolet curable resin (A) (excluding the following compound (B)) and a compound (B) that has an alkylene glycol skeleton represented by a specific chemical formula in the structure, thereby reducing the occurrence of a crack or breaking.
Inventors:
IGAWA KOUSUKE (JP)
NISHIZAWA SHIGETOSHI (JP)
NISHIZAWA SHIGETOSHI (JP)
Application Number:
PCT/JP2021/040521
Publication Date:
May 12, 2022
Filing Date:
November 04, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F220/26; B22C9/04; B29C64/106; B29C64/264; B33Y70/00; B33Y80/00
Domestic Patent References:
| WO2016125758A1 | 2016-08-11 | |||
| WO2019189652A1 | 2019-10-03 |
Foreign References:
| JP2017193660A | 2017-10-26 | |||
| JP2006122915A | 2006-05-18 | |||
| JPH09234542A | 1997-09-09 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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