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Title:
PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL SHAPING, AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/080316
Kind Code:
A1
Abstract:
This photocurable resin composition for three-dimensional shaping contains a polyfunctional radically polymerizable compound (A), a monofunctional radically polymerizable compound (B), polysilsesquioxane-containing particles (C), and a curing agent (D), wherein the ethylenically unsaturated group equivalent of the polyfunctional radically polymerizable compound (A) is 700-7,000 g/eq, and the content of the polysilsesquioxane-containing particles (C) is 5-50 parts by mass with respect to 100 parts by mass of the total of the polyfunctional radically polymerizable compound (A) and the monofunctional radically polymerizable compound (B).

Inventors:
NISHIURA CHIAKI (JP)
Application Number:
PCT/JP2021/037573
Publication Date:
April 21, 2022
Filing Date:
October 11, 2021
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
C08F290/06; B29C64/106; B29C64/268; B33Y10/00; B33Y70/00; B33Y80/00
Domestic Patent References:
WO2018143303A12018-08-09
WO2015163355A12015-10-29
WO2008108390A12008-09-12
WO2021132699A12021-07-01
WO2020241502A12020-12-03
Foreign References:
JP2017165964A2017-09-21
JP2009091451A2009-04-30
JP2018095696A2018-06-21
JP2012032673A2012-02-16
US20180222929A12018-08-09
JP2009062510A2009-03-26
JP2017198458A2017-11-02
JP2020173693A2020-10-22
JP2021163277A2021-10-11
Attorney, Agent or Firm:
ABE Takuma et al. (JP)
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