Title:
PHOTOGRAPHING APPARATUS, PHOTOGRAPHING ASSEMBLY, PAN-TILT ASSEMBLY, AND MOBILE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/000180
Kind Code:
A1
Abstract:
A photographing apparatus (100) comprises a housing (10), an imaging sensing module (20) and a first circuit board (30), the imaging sensing module (20) being disposed within the housing (10); the first circuit board (30) is disposed within the housing (10) and is separated from the imaging sensing module (20); the imaging sensing module (20) and the first circuit board (30) are separately thermally conductively connected to different surfaces of the housing (10), so as to improve temperature uniformity of the housing (10). The present disclosure also relates to a photographing assembly (1000), a pan-tilt assembly (2000), and a mobile device.
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Inventors:
LIU JIXIN (CN)
ZHANG YAWEN (CN)
CAI ZHIWEI (CN)
ZHANG YAWEN (CN)
CAI ZHIWEI (CN)
Application Number:
PCT/CN2021/107459
Publication Date:
January 26, 2023
Filing Date:
July 20, 2021
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
G03B17/55; B64D47/08; G03B17/08
Domestic Patent References:
| WO2020142591A1 | 2020-07-09 |
Foreign References:
| CN213457353U | 2021-06-15 | |||
| CN210093355U | 2020-02-18 | |||
| CN211685666U | 2020-10-16 | |||
| CN207198528U | 2018-04-06 | |||
| JP2009105478A | 2009-05-14 | |||
| CN110896655A | 2020-03-20 |
Attorney, Agent or Firm:
SHENZHEN LIDAO INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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