Title:
PHOTOMASK, EXPOSURE METHOD, METHOD FOR MANUFACTURING RESIN PATTERN, AND METHOD FOR MANUFACTURING PHOTOMASK
Document Type and Number:
WIPO Patent Application WO/2022/044557
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photomask with which adhesiveness to an object to be brought into contact therewith during contact exposure is reduced and a pattern having excellent linearity is formed. The present disclosure provides a photomask (100) and applications of the same, the photomask including a transparent support (10) having a first surface (10a) and a second surface (10b) on the reverse side of the first surface, and a light-blocking layer (20) disposed on part of the first surface (10a) of the transparent support (10), the surface roughness Rz of an exposed portion of the first surface (10a) is 0.1-0.5 μm, and the surface roughness Rz of the light-blocking layer (20) is 0.1-0.5 μm.
Inventors:
KANNA SHINICHI (JP)
MOROZUMI KAZUMASA (JP)
MOROZUMI KAZUMASA (JP)
Application Number:
PCT/JP2021/025672
Publication Date:
March 03, 2022
Filing Date:
July 07, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F1/50; G03F7/20; H05K3/28
Domestic Patent References:
| WO2007074778A1 | 2007-07-05 |
Foreign References:
| JP2010237542A | 2010-10-21 | |||
| JP2008292655A | 2008-12-04 | |||
| JP2005128412A | 2005-05-19 | |||
| JP2014010333A | 2014-01-20 | |||
| JP2007199434A | 2007-08-09 | |||
| JPH09211842A | 1997-08-15 | |||
| JPH02235063A | 1990-09-18 | |||
| JPS62235953A | 1987-10-16 | |||
| JPS5854869B2 | 1983-12-07 | |||
| JP2000258894A | 2000-09-22 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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