Title:
PHOTOPOLYMERIZABLE RESIN COMPOSITION FOR MOLDING, AND MOLDED MULTILAYER ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/069332
Kind Code:
A1
Abstract:
Provided are: a photocurable resin composition for molding, which can be used for forming a resin layer on a transparent resin base and exhibits an excellent adhesion property onto various types of transparent resin bases; and a molded multilayer article having the above-mentioned adhesion property. The photocurable resin composition is characterized by containing (A) a photopolymerizable substance having a (meth)acryloyl group in the molecular structure thereof, (B) a hydrogen-abstraction-type photopolymerization initiator, (C) an intramolecular-cleavage-type photopolymerization initiator and (D) a silicone compound as essential components, wherein the content of the silicone compound (D) is 1.0 to 5.0 parts by mass relative to the total content, i.e., 100 parts by mass, of the components (A) to (C).
Inventors:
SUGIYAMA MASASHI (JP)
KOBAYASHI NOBUO (JP)
KOBAYASHI NOBUO (JP)
Application Number:
PCT/JP2013/078848
Publication Date:
May 08, 2014
Filing Date:
October 24, 2013
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F2/50; B32B27/30; C08F2/44; G02B1/04
Foreign References:
| JP2011052134A | 2011-03-17 | |||
| JP2012190514A | 2012-10-04 | |||
| JP2012062447A | 2012-03-29 | |||
| JP2012189949A | 2012-10-04 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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