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Patent Searching and Data


Title:
PHOTORESIST COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2020/203790
Kind Code:
A1
Abstract:
[Problem] To provide a photoresist composition which enables development with use of a weak alkaline developer liquid and achievement of fine patterning with high resolution, while having excellent releasability. [Solution] A photoresist composition which contains (A) a carboxyl group-containing resin, (B) a photopolymerizable monomer and (C) a thermosetting component, and which is characterized in that if the photoresist composition is applied onto a flat substrate so that the film thickness of the photoresist composition after curing is 2 μm ± 0.5 μm, and is subsequently cured, after 30-minute prebaking at 75°C, by being exposed to ultraviolet light 1 including the wavelength of 375 nm in the ambient atmosphere with the amount of exposure light of 1,000 mJ/cm2, and Ra1 is the arithmetic mean roughness Ra of the surface of a cured coating film 1 that is formed by subsequent 180-second development at 30°C with use of a 1 wt% aqueous Na2CO3 solution, while Ra2 is the arithmetic mean roughness Ra of the surface of a cured coating film 2 that is formed by exposing the cured coating film 1 to ultraviolet light 2 including the wavelength of 185 nm and the wavelength of 254 nm in an oxygen atmosphere with the amount of exposure light of 25.2 mJ/cm2, Ra1 and Ra2 satisfy the formula Ra2/Ra1 ≤ 4.5 × 10-1.

Inventors:
SHIBATA DAISUKE (JP)
ARAI YASUAKI (JP)
SATO KAZUYA (JP)
WEI XIAOZHU (JP)
Application Number:
PCT/JP2020/014076
Publication Date:
October 08, 2020
Filing Date:
March 27, 2020
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/027; G03F7/037; G03F7/20; G03F7/26; G03F7/40
Foreign References:
JP2006011039A2006-01-12
JP2012208453A2012-10-25
JP2010152154A2010-07-08
JP2009003000A2009-01-08
JPH1073923A1998-03-17
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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